Tutorial CALL CICMT2008

Jmueller

Description

thIMAPS/ACerS 4 International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2008) April 21-24, 2008 TUTORIAL Information 21.04.2008 To be held at: Fraunhofer Institut für Zuverlässigkeit und Mikrointegration, Hansastraße 27 Munich, Germany Organised by: TUTORIALS ON CERAMIC ELECTRONICS 21 APRIL 2008 MUNICH Dear Conference Participant, in conjunction with IMAPS CICMT 2008 conference on Ceramic Interconnect and Microsystems IMAPS Europe Liaison Committee will organise two tutorials on specific, current technologies enabling you to get deep knowledge in that field. The teachers are known European ceramic specialists with a combination of research and industrial know how. Each Tutorial is 4 h long and they run in parallel on Monday April 21 from 13:00 to 17:00 to fit with the CICMT programme. Tutorial 1: LTCC for Micro- and Millimetre-Wave Applications Tutorial 2: Ceramic pressure sensors: From materials to devices Fee / tutorial: 240 € / person, including all material and coffee refreshments. Students can participate for 195 € / person with same services. Student card need to be shown at arrival. Registration and payment: please send e-mail to Paul Collander ([e-mail]) Payment will be based on invoice. ndDeadline for registration: April 2 . Location: The tutorials are held at Fraunhofer Institut ...

Informations

• Publié par: Pidel
• Nombre de lectures: 28
• Langue: English

Extrait

IMAPS/ACerS 4

th

International Conference and Exhibition on

Ceramic Interconnect and

Ceramic Microsystems Technologies

(CICMT 2008)

April 21-24, 2008

TUTORIAL

Information

21.04.2008

To be held at:

Fraunhofer Institut für Zuverlässigkeit und Mikrointegration,

Hansastraße 27

Munich, Germany

Organised by:

TUTORIALS ON CERAMIC ELECTRONICS 21 APRIL 2008 MUNICH

Dear Conference Participant,

in conjunction with IMAPS CICMT 2008 conference on Ceramic Interconnect and Microsystems

IMAPS Europe Liaison Committee will organise two tutorials on specific, current technologies

enabling you to get deep knowledge in that field. The teachers are known European ceramic specialists

with a combination of research and industrial know how. Each Tutorial is 4 h long and they run in

parallel on Monday April 21 from 13:00 to 17:00 to fit with the CICMT programme.

Tutorial 1: LTCC for Micro- and Millimetre-Wave Applications

Tutorial 2: Ceramic pressure sensors: From materials to devices

Fee / tutorial:

240 € / person, including all material and coffee refreshments.

Students can participate for 195 € / person with same services. Student

card need to be shown at arrival.

Registration and payment:

please send e-mail to Paul Collander (

[e-mail]

)

Payment will be based on invoice.

Deadline for registration:

April 2

nd

.

Location:

The tutorials are held at Fraunhofer Institut Zuverlässigkeit und

Mikrointegration, Hansastraße 27 d, D-80686 München, an easy ride

from Conference hotel. More details and S-Bahn information will be sent

to registrants.

Cancellation Policy:

We keep the rights to cancel any tutorial if too few register on time.

General questions can be sent to:

Paul Collander

President IMAPS Europe

Phone [phone]

[e-mail]

www.imapseurope.org

Tutorial 1: LTCC for Micro- and Millimetre-Wave Applications

•

LTCC Process

•

3D-Simulation and Test Methods

•

Applications in Telecommunication and Sensor Electronics

Speakers:

Reinhard Kulke, Peter Uhlig (IMST GmbH)

Abstract:

LTCC as a ceramic multilayer technology has a great potential for micro- and millimetre-wave applications. The dielectric tapes as

well as the gold and silver conductors have the appropriate physical and electrical performance. In spite of being a very mature

technology, LTCC has recently gone through large improvements in material development and has become available for

communication equipment manufacturers through LTCC foundries. The competitive price of materials and production make LTCC

an ideal basis for System in a Package (SiP) and Multi Chip Modules (MCM). LTCC circuits can consist of a nearly arbitrary

number of layers. Components can be integrated in cavities. LTCC substrates are rugged, hermetic and environmentally stable.

These features and further favourable characteristics are utilized to develop compact and efficient modules for communication and

sensor applications.

Who Should Attend?

The course is dedicated to scientists and engineers working in research and development of RF, micro- and millimetre-wave

modules. The participants should have a basic knowledge in RF- and/or microwave design. It will give managers an understanding

of this technology.

Learning Objectives / Outcome

At the end of the day the audience will have a basic overview and knowledge about LTCC substrate and conductor materials,

process steps and design rules. A specific focus will lie upon the design of micro- and millimetre-wave circuits and antennas. This

includes typical waveguides in LTCC as well as transitions, housing, filters and other passive components. Solutions for entire

transceiver modules will be discussed to give the participants an insight into the design and development of basic and complex

circuits. Keywords for typical applications are ISM-Band and Frontend Modules, Radar and sensor technology.

About IMST GmbH:

IMST GmbH provides radio communication solutions for mobile applications, industrial automation, and medical technologies. Our

clients count on us for comprehensive technology solutions. The LTCC team at IMST designs your RF circuits and antennas from

MHz to high GHz frequencies. Our experts also provide real 3D electromagnetic modelling and simulation to meet the challenges of

highly integrated multilayer RF circuits. A group of specialists in LTCC manufacturing and characterization are available at our

sophisticated facilities. Our team puts more than 10 years of industry-related and application-driven R&D experience at your

service. Though IMST GmbH maintains excellent relationship to LTCC material suppliers as well as LTCC foundries it acts

completely independent from these organizations.

About the Speakers:

Dipl.-Ing. Reinhard Kulke:

Electrical engineer since 1991; Head of unit “RF Modules”; Responsible for R&D in RF and

microwave circuit design in LTCC; More than 30 publications with focus on ceramic applications; Organizer of several seminars

and workshops.

Dipl.-Ing. Peter Uhlig:

Electrical engineer since 1984. Responsible for the Hybrid Microelectronics Laboratory which includes the

LTCC prototyping line; Expert in RF and microwave packaging, thin film, PCB, LTCC, assembly and integration techniques.

Tutorial 2: Ceramic pressure sensors: From materials to devices

•

Piezoresistive, piezoelectric and capacitive pressure sensors

•

Piezoelectric materials

•

Numerical modelling

•

Design and realisation of sensors

•

Benchmarking – different types of sensors

Speakers:

Marija Kosec, Darko Belavi

č

, Marina Santo-Zarnik (Jozef Stefan Institute (JSI) and HIPOT)

Abstract:

The working principles of three types of pressure sensors, realised in thick-film technology on ceramic substrates, i.e.,

piezoresistive, piezoelectric and capacitive sensors will be presented. Main technology features of all three types with a special

emphasis on piezoelectric devices will be described. Part of the lecture will be devoted to the basics of ferro- and piezo-electric

materials as well as to the preparation, processing and characterisation of some piezoelectric ceramics powder and thick films. The

compatibility of active materials with different substrates namely alumina and LTCC are reported. The use of barrier layers to

minimize the reactions between active films and substrates will be described.

Finite-element analysis (FEA) has proved to be very useful in research and in the design phases of various Ceramic-MEMS

(Ceramic Micro-Electro-Mechanical Systems) devices. However, designers should be aware that use of unverified material

parameters from the literature can result in an unacceptable discrepancy between the predictions and the real structure properties.

Some examples of the characterisation–modelling-validation procedure for the thick-film piezoelectric sensor/actuator structures

will be presented. Calculated results will be compared with measurements on realised devices.

As the conclusion the benchmarking of different types of sensors will be given. The advantages and weaknesses will be compared

and commented.

Who Should Attend?

The course is dedicated to scientists and engineers working in research, development and application of pressure sensors but also

students. The participants should have a basic knowledge in materials for electronic ceramics. It will give an understanding of

working principles of pressure sensors, technology challenges and will draw attention to the advantages of different types, e.g.,

resistive or piezoelectric sensing elements realised in the thick film technology.

Learning Objectives / Outcome

At the end of the lecture the participants will have a basic understanding of piezoelectric ceramics materials. The essential

knowledge on different types of pressure sensors their technologies as well the advantages and limitations will be obtained. The

comparison of the calculated with measured results will highlight the use of numerical modelling for this particular field.

About JSI and HIPOT:

The Electronic Ceramics Department at the Jožef Stefan Institute is active in the research of the synthesis, properties and

applications of materials for electronics, mainly complex ceramics multifunctional materials and structures. It has a group

working on various problems of thick film technology with common effort of material scientists and electronic engineers.

HIPOT is a private company basically acting as a link between academia and industry.

About the Speakers:

Prof. Dr. Marija Kosec:

senior research associate and a head of Electronic Ceramic Department at JSI also Prof of Material

Science at the University of Ljubljana.

Darko Belavi

č

, univ.dipl.eng.el.:

A head of HIPOT Research and Development Group and researcher on following areas: hybrid

microcircuits, pressure sensors, thick-film technology, ceramic interconnection technologies and ceramic microsystems

technologies.

Dr. Marina Santo-Zarnik:

A project leader of research projects and researcher on following areas: design hybrid microcircuits and

sensors, characterisation and finite-element modelling of thick-film structures, and simulation of ceramic microsystems.