Technische Universit¨at Mu¨nchenLehrstuhl fu¨r NanoelectronicsWired and Wireless Inter-Chip andIntra-Chip CommunicationsHristomir YordanovVollsta¨ndiger Abdruck der von der Fakult¨at fur¨ Elektrotechnik undInformationstechnik der Technischen Universit¨at Munc¨ hen zur Erlangung desakademischen Grades eines– Doktor-Ingenieurs –genehmigten Dissertation.Vorsitzende: Univ.-Prof.Dr.rer.nat. Doris Schmitt-LandsiedelPruf¨ er der Dissertation: 1. Univ.-Prof.Dr.techn. Peter Russer2. Univ.-Prof.Dr.techn. Josef A. NossekDie Dissertation wurde am 11.10.2010 bei der Technischen Universit¨atMunc¨ hen eingereicht und durch die Fakult¨at fur¨ Elektrotechnik undInformationstechnik am 02.02.2011 angenommen.ACKNOWLEDGEMENTSI wish to thank Professor Peter Russer for offering me the opportunity to joinhis team and work on my thesis. Special thanks go to the rest of the projectparticipants, Professors Josef A. Nossek and Tobias Noll and my colleaguesMichel Ivrlaˇc, Amine Mezghani and Matthias Korb. Warm thanks to Klaus,Susanne and Mark, my friends and colleagues who supported me during myyears in Mu¨nchen.I could not have done this work without the support of my family, Boyanand Dessie.Cheers.iiiCONTENTS1 Introduction 12 Theoretical Methods for the Analysis of a Multi-ConductorTransmission Line (MTL) 72.1 Multi-Conductor Transmission Line Equations . . . . . . . . . 82.2 TheGeneralSolutionoftheMulti-ConductorTransmissionLineEquations . . . . . . . . . . . . . . .