Power cycling capability of advanced packaging and interconnection technologies at high temperature swings [Elektronische Ressource] : / submitted by Raed Amro

Raed

Informations

• Publié par: technische_universitat_chemnitz
• Publié le: 01 janvier 2006
• Nombre de lectures: 35
• Langue: English
• Poids de l'ouvrage: 20 Mo

Extrait

Power cycling capability
of advanced packaging and interconnection
technologies at high temperature swings


By the faculty of Electrical Engineering and Information Technology at Chemnitz
university of Technology


approved

Dissertation

In fulfilment of the requirements for the degree

Doktor-Ingenieur (Dr.-Ing.)

submitted by

Dipl.-Ing. Raed Amro

Born in 04.03.1969 in Dura-Hebron/ Palestine






Date of submission: 24.04.2006


Examiners: Prof. Dr.- Ing. Josef Lutz
Prof. Dr.- Ing. Andreas Lindemann
Dr. Reinhold Bayerer


Date of defence: 21.07.2006

Lastwechselfestigkeit von modernen Aufbau- und
Verbindungstechniken bei hohen Temperaturhüben



von der Fakultät für Elektrotechnik und Informationstechnik der Technischen
Universität Chemnitz


genehmigte

Dissertation

zur Erlangung des akademischen Grades

Doktor-Ingenieur (Dr.-Ing.)


Vorgelegt von


Dipl. Ing. Raed Amro

geboren am 04.03.1969 in Dura-Hebron/Palästina



eingereicht am: 24.04.2006


Gutachter: Prof. Dr.- Ing. Josef Lutz
Prof. Dr.- Ing. Andreas Lindemann
Dr. Reinhold Bayerer


Tag der Verleihung: 21.07.2006
Acknowledgement

This work accrued during my employment as a scientific co-worker at the chair of Power
Electronics and Electromagnetic Compatibility (PE/EMC) at Chemnitz university of
technology/Germany.

My special thanks go to Prof. Dr.-Ing. Josef Lutz for his support and professional suggestions
which made this work possible. Further thanks are due to Prof. Dr.-Ing. Andreas Lindemann
and Dr. Reinhold Bayerer for the valuable discussions and their role as joint examiners.

I also thank:

All my colleagues at the chair PE/EMC for their support and the good working atmosphere.

The students who supported me with their works.

Mrs. Iris Höbelt from center of microtechnologies at Chemnitz university of technology for
the scanning electron microscopy.

Prof. Dr. Roland Sittig, Dr.-Ing. Jacek Rudzki from Technical University at Braunschweig
and Dr.-Ing. Markus Thoben from Infineon Technologies AG/Warstein for their precious
cooperation in the reliability investigation of the Low Temperature Joining Technique.

Dr. Uwe Scheuermann from Semikron International and Dr. Max H. Poech from Fraunhofer
Institute for Silicon Technology ISIT for the valuable discussions and tips.

My wife Maysa and son Aziz for support and patience.

And last but not least, my parents for being there.



Chemnitz, July 2006






Dedicated to my father who passed away three weeks before my defence i


Contents



1 Einleitung .......................................................................................................................... 1

2 Kurzfassung ...................................................................................................................... 3

3 Motivation........... 5

4 Thermal analysis in power electronics ........................................................................... 7

4.1 Theory of heat transfer ................................................................................................7

4.2 Mechanisms of heat transfer ....................................................................................... 8

4.3 Analogy between thermal and electrical systems ....................................................... 9

4.4 Thermal networks...................................................................................................... 10

4.4.1 Types of thermal networks................................................................................. 10

4.4.2 Transformation of ‘Foster’ network into ‘Cauer’ network ................................ 12

4.4.3 Simulation of thermal behaviour of power devices using Cauer network ......... 12

5 Packaging and interconnection technologies in power electronics............................ 16

5.1 Packaging concepts of power components.................................................................. 16

5.1.1 Discrete power devices....................................................................................... 17

5.1.1.1 TO-family.................................................................................................... 17

5.1.1.2 DCB based, transfer molded devices .......................................................... 18

5.1.1.3 Hockey puck packages................................................................................ 19

5.1.2 Power modules ................................................................................................... 19

5. 2 Advancements in standard power modules............................................................. 20

5.2.1 ECONOPACK family......................................................................................... 20

5.2.2 Pressure contacted modules ............................................................................... 22

5.2.3 Intelligent power modules (IPM) ....................................................................... 23 ii

5.3 Interconnection technologies in power electronics ................................................... 23

5.3.1 Wire bonding technology................................................................................... 23

5.3.2 Soft solders......................................................................................................... 25

5.4 Advancements in the interconnection technologies................................................. 25

5.4.1 Advancements in wire bonding techniques........................................................ 25

5.4.2 Advancements in soldering and joining techniques........................................... 27

5.5 Low temperature joining technique (LTJT).............................................................. 28

5.5.1 Principle and performances of the LTJT............................................................ 28

5.5.2 Joining procedure of the LTJT........................................................................... 29

5.5.2.1 Powder application...................................................................................... 29

5.5.2.2 Joining process ............................................................................................ 30

6 Failure mechanisms in power devices ......................................................................... 33

6.1 Failure mechanisms of bond wires............................................................................ 33

6.2 Reconstruction of the Al metallization...................................................................... 38

6.3 Electromigration........................................................................................................ 39

6.4 Solder-joints degradation .......................................................................................... 41

6.5 Electrical and mechanical aging of DCB .................................................................. 43

6.6 Die fracture................................................................................................................ 45

7 Reliability prediction in power electronics 46

7.1 Lifetime prediction using accelerated aging tests ..................................................... 46

7.1.1 Temperature cycling tests................................................................................... 46

7.1.2 Power cycling tests............................................................................................. 47

7.1.2.1 Impact of test parameters on N .................................................................. 48 f

7.1.2.2 Extrapolation of life-time models based on results of power cycling tests. 50

7.1.2.3 Statistical analysis of the reliability test results ......................................... 51
iii
7.2 Failure analysis techniques........................................................................................ 53

7.3 Power cycling reliability of standard power modules (LESIT project) .................... 55

8 Thermal measurements in power electronics .............................................................. 59

8.1 Methods of measuring T ........................................................................................... 59 j

8.2 R measuring set-up.................................