Étude expérimentale et théorique de microcaloducs et technologie silicium

Pandraud Guillaume

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REFERENCES BABIN BR, PETERSON GP, WU D Analysis and testing of a micro heat pipe during steady-state operation. ASME / AIChE National Heat Transfer Conference, Philadelphia, Aug. 5-8, 1989, pp. 1-10. Steady-state modeling and testing of a micro heat pipe. J Heat Transfer, 1990, vol. 112, pp. 595-601. BADRAN B, GERNER FM, RAMADAS P, HENDERSON T, BAKER KW Experimental results for low-temperature silicon micromachined micro heat pipe arrays using water and methanol as working fluids. Experimental Heat Transfer, 1997, vol. 10, pp. 253-272. BOUSSEY J Technologie d'assemblage de tranches et procédés dérivés In : De Labachelerie M Techniques de fabrication des microsystèmes 2 : systèmes microélectromécaniques 3D et intégration de matériaux actionneurs, Paris : Lavoisier, 2004, pp. 135-174. (Traité EGEM, série Mycrosystèmes) BRUTIN D Ecoulements liquides en microtubes et ébullition convective en minicanaux : étude expérimentale et modélisation. Thèse de Doctorat, Université de Provence, 2003, 274 p. CAO Y, FAGHRI A, MAHEFKEY ET Micro/miniature heat pipes and operating limitations. Nat. Heat Transfer Conf., Atlanta, ASME- HTD, 1993, vol. 236, pp. 55-62. CAO Y, GAO M, BEAM JE, DONOVAN B Experiments and analysis of flat miniature heat pipes. Journal of Thermophysics and Heat Transfer, 1997, vol. 11, n° 2, pp. 158-164. CAREY VP Liquid – vapor phase change phenomena: an introduction to the thermophysics of vaporization and condensation processes in ...

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• Publié par: Ewlie
• Nombre de lectures: 73
• Langue: English

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REFERENCES

BABIN BR, PETERSON GP, WU DAnalysis and testing of a micro heat pipe during steady- state operation.ASME / AIChE National Heat Transfer Conference,Philadelphia,Aug. 5-8, 1989, pp. 1-10.

BABIN BR, PETERSON GP, WU DSteady-state modeling and testing of a micro heat pipe. J Heat Transfer,1990, vol. 112, pp. 595-601.

BADRAN B, GERNER FM, RAMADAS P, HENDERSON T, BAKER KW Experimental results for low-temperature silicon micromachined micro heat pipe arrays using water and methanol as working fluids.Experimental Heat Transfer,1997, vol. 10, pp. 253-272.

BOUSSEY JTechnologie d'assemblage de tranches et procédés dérivésIn :De Labachelerie MTechniques de fabrication des microsystèmes 2 : systèmes microélectromécaniques 3D et intégration de matériaux actionneurs(Traité EGEM,, Paris : Lavoisier, 2004, pp. 135-174. série Mycrosystèmes)

BRUTIN DEcoulements liquides en microtubes et ébullition convective en minicanaux: étude expérimentale et modélisation.Thèse de Doctorat, Université de Provence, 2003, 274 p.

CAO Y, FAGHRI A, MAHEFKEY ETMicro/miniature heat pipes and operating limitations. Nat. Heat Transfer Conf.,Atlanta, ASME- HTD,1993, vol. 236, pp. 55-62.

CAO Y, GAO M, BEAM JE, DONOVAN BExperiments and analysis of flat miniature heat pipes.Journal of Thermophysics and Heat Transfer, 1997, vol. 11, n° 2, pp. 158-164.

CAREY VPLiquid – vapor phase change phenomena: an introduction to the thermophysics of vaporization and condensation processes in heat transfer equipment.DC: Washington, Hemisphere, 1992, 645 p.

CIOULACHTJIAN S, LAUNAY S, LALLEMAND M Anglesde contact en milieu saturé ème d’une goutte d’eau sur une surface d’oxyde de silicium.SFT,11 CongrèsGrenoble, 3-6 juin 2003, pp. 403-407.

COLIN SMicrofluidique.Traité EGEM, Paris : Hermès, 2004, 392 p. (Série Microsystèmes)

COTTER TPPrinciples and prospects for micro heat pipes.5th Int. Heat Pipe Conf.,Tsukuba, Japan,1984, May 14-18, vol. 4, pp. 328-334.

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(*) DERJAGUIN BV Definitionof the concept of, and magnitude of the disjoining pressure and its role in the statics and kinetics of thin layers of liquids.Kolloidny Zhurnal,1955, vol. 17, pp. 191-197.

(*) DERJAGUIN BV,ZORIN ZMOptical study of the adsorption and surface condensation of nd vapours in the vicinity of saturation on a smooth surface.Congr. Surface Activity2 Int., London, 1957, vol. 2, pp. 145-152.

DUNCAN AB, PETERSON GPoptimization for a triangular-shaped etched micro Charge heat pipe.J. Thermophysics,1994, vol. 9, n° 2, pp. 365-368.

DUNN PD, REAY DAHeat pipes. Oxford: Pergamon Press Ltd., 1978, 334 p.

FAGHRI AHeat pipe Science and Technology.Washington: Taylor & Francis, 1995, 874 p.

GERNER FM, LONGTIN JP, HENDERSON HT, HSIEH WM, RAMADAS P, CHANG WS Flow and heat transfer limitations in micro heat pipes.Proceedings of the 28th National Heat Transfer Conference: Topics in Heat Transfer, HTD–206–3, San Diego, CA, Aug. 9–12, pp. 99-104.

HA JM, PETERSON GPprediction of the axial dryout point for evaporating Analytical liquids in triangular microgrooves.J Heat Transfer, 1994, vol. 116, pp. 468-503.

HA JM, PETERSON GP Theheat transport capacity of micro heat pipes.J Heat Transfer, 1998, vol. 120, pp. 1064-1071.

HALLINAN KP, CHEBARO HC, KIM SJ, CHANG WS Evaporatingfrom an extended meniscus for nonisothermal interfacial conditions.Journal of Thermophysics and Heat Transfer, 1994, vol. 8, n° 4, pp. 709-716.

HOLM FW, GOPLEN SPtransfer in the meniscus thin-film transition region. HeatJ Heat Transfer,1979, vol. 101, 543-547.

HUANG XY, LIU CY, TOH KC Atransient three-dimensional model of micro heat pipes used as an integral part of semiconductor devices.Microelectromechanical Systems (MEMS), ASME,1996, vol. 59, pp. 37-47.

JIANG L, WONG M, ZOHAR YPhase change in microchannel heat sinks with integrated temperature sensors.J Microelectromech Syst, 1999, vol. 8, pp. 358-365.

JIANG L, WONG M, ZOHAR YTransient temperature performance of an integrated micro- thermal system.J Micromech Microeng, 2000, vol. 10, pp. 466-476.

JUDY J, MAYNES D, WEBB BWof frictional pressure drop for liquid Characterization flows through microchannels.Int J Heat Mass Transfer, 2002, vol. 45, pp. 3477-3489

KAMINS TPolycristalline silicon for integrated circuits application.Norwell: Kluwer Academic Publishers, 1988, 290 p.

(*) Le nom de B.V. Derjaguin est parfois orthographié Deryagin.

165

KAMOTANI YAnalysis of axially grooved heat pipe condensers,AIAA Paper 76-147, 1976.

KANG S-W, HUANG DFabrication of star grooves and rhombus grooves micro heat pipe. J Micromech Microeng, 2002, vol. 12, pp. 525-531

KHRUSTALEV D, FAGHRI AThermal analysis of a micro heat pipe.J Heat Transfer,1994, vol. 116, pp. 189-198.

KHRUSTALEV D, FAGHRI Atransfer during evaporation on capillary-grooved Heat structures of heat pipes.J Heat Transfer, Aug. 1995, vol. 117, pp. 740-747.

KHRUSTALEV D, FAGHRI Aliquid and vapor flow in miniature passages with Coupled micro grooves.J Heat Transfer, 1999, vol. 121, pp. 729-733.

LAUNAY Sthermiques de microcaloducs usinés dans du silicium – Performances Modélisation et étude expérimentale.Thèse de Doctorat, INSA Lyon, 2002, 187 p.

LAUNAY S, SARTRE V, LALLEMAND MThermal study of a water-filled micro heat pipe including heat transfer in evaporating and condensing microfilms.Twelfth International Heat Transfer Conference, Grenoble (18-23 août 2002), vol. 4, pp. 471-476.

LAUNAY S, SARTRE V, LALLEMAND M Experimentalstudy on silicon micro-heat pipe arrays,Applied Thermal Engineering,2004, vol. 24, n° 2-3, pp. 233-243.

LE BERRE M, LAUNAY S, SARTRE V, LALLEMAND MFabrication and experimental investigation of silicon micro heat pipes for cooling electronics.J Micromech Microeng, 2003, vol. 13, pp. 58-64.

LE PERSON S, FAVRE-MARINETM: Effets d’échelle sur lesDes mini aux micro-canaux lois d’évolution des coefficients de frottement et d’échanges thermiques,Congrès Français de Thermique, Vittel, Juin 2002, pp. 59-64

LEE M, WONG M, ZOHAR YDesign, fabrication and characterization an integrated micro th heat pipe.15 IEEEInternational Conference on MEMS,Las Vegas, Jan 20-24 2002, pp. 85- 88.

LEE M, WONG M, ZOHAR Yof an integrated micro heat pipe. Characterization J Micromech Microeng, 2003, vol. 13, pp. 58-64.

LONGTIN JP, BADRAN B, GERNER FM Aone-dimensional model of a micro heat pipe during steady-state operation.J Heat Transfer,1994, vol. 116, pp. 709-715.

MA HB, PETERSON GPTemperature variation and heat transfer in triangular grooves with an evaporating film.Journal of Thermophysics and Heat Transfer,1997, vol. 11, n° 1, pp. 90- 97.

MA HB, PETERSON GPminimum meniscus radius and capillary heat transport limit The in micro heat pipes.J Heat Transfer,1998, vol. 120, pp. 227-233.

166

MADOU MJFundamentals of microfabrication – The science of miniaturization. Boca Raton: CRC Press, 2002, 723 p.

MALHAIRE CCaractérisation et modélisation de microtransducteurs de pression à hautes performances intégrés sur silicium.Thèse de doctorat,INSA Lyon,1998, 202 p.

MALLIK AK, PETERSON GPSteady-state investigation of vapor deposited micro heat pipe arrays.J Electronic Packaging,1995, vol. 117, pp. 75-81.

MALLIK AK, PETERSON GP, WEICHOLD MH Onthe use of micro heat pipes as an integral part of semi conductor devices.J Electronic Packaging, 1992,vol. 114, n° 4, pp. 436-442.

MALLIK AK, PETERSON GP, WEICHOLD MHFabrication of vapor-deposited micro heat pipe arrays as an integral part of semiconductor devices.J of Microelectromech Systems, 1995, vol. 4, n° 3, pp. 119-131.

MARTYNOV, GAStructural component of disjoining pressure.Colloid Journal, 2000, vol. 62, n° 3, pp. 348-354.

NIKLAS M, FAVRE-MARINET MPressure losses in a network of triangular microchannels In :Kandlikar SG, Celada GP, Eds.First International Conference on Microchannels and Minichannels,Rochester, USA,April 2003, New York: ASME, 2003, pp. 335-342,.

PETERSON GPAn introduction to heat pipes – Modelling, testing and applications.York: New John Wiley & Sons, 1994, 356 p.

PETERSON GP, MA HBTemperature response of heat transport in a micro heat pipe.J Heat Transfer,1999, vol. 121, pp. 438-445.

PETERSON GP, DUNCAN AB, AHMED AS, MALLIK AK, WEICHOLD MH Experimental investigation of micro heat pipes in silicon wafers.Micromechanical Sensors, Actuators, and Systems,ASME-DSC, 1991, vol. 32, pp. 341-348.

PETERSON GP, DUNCAN AB, WEICHOLD MHExperimental investigation of micro heat pipes fabricated in silicon wafers.J Heat Transfer,1993,vol. 115, pp. 751-756.

ROUSSEL P, LYSENKO V, REMAKI B, DELHOMME G, DITTMAR A, BARBIER DThick oxidized porous silicon layers for the design of a biomedical thermal conductivity microsensor.Sensors & Actuators, 1999,vol.74, pp. 100-103.

SARTRE V, ZAGHDOUDI MC, LALLEMAND M Effectof interfacial phenomena on evaporative heat transfer in micro heat pipes.Int J Therm Sci, 2000, vol. 39, pp. 498-504.

SOBHAN CB, XIAOYANG H, YU LC Finitedifference analysis of transient vapor and liquid flow in a micro heat pipe channel.Two-Phase Flow Modelling and Experimentation, Roma, Ed. ETS,1999, pp. 1593-1599.

167

SOBHAN CB, XIAOYANG H, YU LCon transient and steady-state Investigations performance of a micro heat pipe.Journal of Thermophysics and Heat Transfer,April-June 2000, vol. 14, n° 2, pp. 161-169.

STEPHAN P Microscaleevaporative heat transfer: modelling and experimental validation. th 12 InternationalHeat Transfer Conference,Grenoble, Aug. 18-23, 2002, vol. 1, pp. 315-327

STEPHAN PC, BÜSSE CAAnalysis of the heat transfer coefficient of grooved heat pipe evaporator walls.Int J Heat Mass Transfer,1992, vol. 35, n° 2, pp. 383-391.

SUH J-S, GREIF R, GRIGOROPOULOS CPFriction in micro-channel flows of a liquid and vapor in trapezoidal and sinusoidal grooves.Int J Heat Mass Transfer, 2001, vol. 44, pp. 3103-3109.

VOLKLEIN F, BALTES HThermoelectric properties of polysilicon films doped with phosphorous and boron.Sensors & Mat,1992, vol. 3, pp. 325-334.

WAYNER PC, KAO YK, LACROIX LVinterline heat-transfer coefficient of an The evaporating wetting film.Int J Heat Mass Transfer, 1976, vol. 19, n°2, pp. 487-492.

WU D, PETERSON GPof the transient characteristics of a micro heat pipe. Investigation J Thermophysics,1991, vol. 5, n° 2, pp. 129-134.

WU D, PETERSON GP, CHANG WS Transientexperimental investigation of micro heat pipes.J Thermophysics,1991, vol. 5, n° 4, pp. 539-544.

ZAGHDOUDI MC, SARTRE V, LALLEMAND M Theoreticalinvestigation of micro heat pipes performance.10th IHPC,Stuttgart, Germany,21-25 Sept. 1997, 6 p. ZHANG JT, WANG BXof capillarity at liquid-vapor interface on phase change Effect without surfactant.Int J Heat Mass Transfer, 2002, vol. 45, n° 13, pp. 2689-2694.