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Frost & Sullivan Honours Infineon for Simplifying Dual Interface and Contactless Card Manufacturing with 'Coil on Module' Package Technology

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Frost & Sullivan Honours Infineon forFrost & Sullivan Honours Infineon for Simplifying Dual Interface and Contactless Card Manufacturing with 'Coil on Module' Package Technology PR Newswire LONDON, Dec. 10, 2013 - The Flip Chip technology, coupled with a radio frequency link rather than a physical link, is a product innovation that responds perfectly to industry challenges Based on its recent analysis of the smart card solutions market, Frost & Sullivan recognises Infineon Technologies AG (Infineon) with the 2013 Global Frost & Sullivan Award for New Product Innovation Leadership. Infineon has developed the flexible 'Coil on Module' chip package and related card antenna designs to accelerate introduction of cards that can be used for both contact-based as well as contactless applications. The new package technology improves the robustness of the cards and makes their manufacturing process more efficient and up to five times faster than with conventional technologies. It allows flexible card design hence enabling card manufacturers to better serve growing demand for contactless solutions without requiring major investments in new manufacturing equipment. At the same time, banks and financial institutions benefit from improved performance, and longer lifetime and simplified supply chain of the final products. Infineon's modules, chips and antenna portfolio in contactless technologies have been successful in addressing the dual interface market.
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Frost & Sullivan Honours Infineon for Simplifying Dual Interface and Contactless Card Manufacturing with 'Coil on Module' Package Technology

PR Newswire

- The Flip Chip technology, coupled with a radio frequency link rather than a physical link, is a product innovation that responds perfectly to industry challenges