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TUTORIAL
ARCHIVE 2007
TUTORIAL 1
“ATE PRINTED CIRCUIT BOARD DESIGN;
PERFORMANCE VS. DESIGN FOR MANUFACTURABILITY
VS. TIME TO TEST”
by
Steve Arobio – Chief Operating Officer, Dynamic Test
Solutions

CURRENT PRINTED CIRCUIT BOARD design requirements have challenged the
manufacturing processes to new limits. In the ATE industry in particular,
test performance, signal speeds, multi-site device testing and shortened
time to test demands have pushed the PCB Industry to more layers,
tighter pitch, higher aspect ratios, exotic materials and customized
processes. At times, the consequences have been poor yields, extensive
test floor trouble-shooting, longer lead times and higher costs. This tutorial
will address several of the performance drivers, along with the possible
trade-offs associated with each of them, to give the Test Engineer a
choice.
COPYRIGHT NOTICE
The papers in this publication comprise the proceedings of the 2007 BiTS Workshop. They reflect the
authors’ opinions and are reproduced as presented , without change. Their inclusion in this publication
does not constitute an endorsement by the BiTS Workshop, the sponsors, BiTS Workshop LLC, or the
authors.
There is NO copyright protection claimed by this publication or the authors. However, each presentation
is the work of the authors and their respective companies: as such, it is strongly suggested that any use
reflect proper acknowledgement to the appropriate source. Any questions ...

Sujets

• Manufacturing Process Management
• Carmageddon
• Copperbelt
• Design transport
• Transfert de couche 2
• Autocommutateur téléphonique privé

Informations

• Publié par: Oslou
• Nombre de lectures: 49
• Langue: English
• Poids de l'ouvrage: 2 Mo

Extrait

 

 

TU

  ARCHIVE 2007

TORIAL 

T ORUTL IA 1   ATE   P RINTED C IRCUIT B OARD D ESIGN ;   “ P ERFORMANCE VS .   D ESIGN FOR M ANUFACTURABILITY VS .   T IME TO T EST ” by   Steve Arobio– Chief Operating Officer, Dynamic Test Solutions   C URRENT PRINTED CIRCUIT BOARD design requirements have challenged the manufacturing processes to new limits. In the ATE industry in particular, test performance, signal speeds, multi-site device testing and shortened time to test demands have pushed the PCB Industry to more layers, tighter pitch, higher aspect ratios, exotic materials and customized processes. At times, the consequences have been poor yields, extensive test floor trouble-shooting, longer lead times and higher costs. This tutorial will address several of the performance drivers, along with the possible trade-offs associated with each of them, to give the Test Engineer a choice.  

COPYRIGHT NOTICE   The papers in this publication comprise the proceedings of the 2007 BiTS Workshop. They reflect the authors opinions and are reproduced as presented , without change. Their inclusion in this publication does not constitute an endorsement by the BiTS Workshop, the sponsors, BiTS Workshop LLC, or the authors.   There is NO copyright protection claimed by this publication or the authors. However, each presentation is the work of the authors and their respective companies: as such, it is strongly suggested that any use reflect proper acknowledgement to the appropriate source. Any questions regarding the use of any materials presented should be directed to the author/s or their companies.   All photographs in this archive are copyrighted by BiTS Workshop LLC. The BiTS logo and Burn-in & Test Socket Workshop are trademarks of BiTS Workshop LLC.

  

 

2007

Turorial 1

ATE PRINTED CIRCUIT BOARD DESIGN DESIGN vs. MANUFACTURING CAPABILITIES vs. TIME TO MARKET

BiTS 2007 Tutorial

by Steve Arobio Dynamic Test Solutions

March 11 - 14, 2007

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2007

Turorial 1

ATE PRINTED CIRCUIT BOARD DESIGN

Printed Circuit Board Industry History of the Printed Circuit Board PCB Manufacturing Process:  Basic Building Blocks ATE Technology Challenges PCB Manufacturing Limitations Bridging the GAP

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2007

Turorial 1

ATE PRINTED CIRCUIT BOARD DESIGN

Automated Test Design

 Technology Challenges  Cost Drivers  Design for Manufacturing  Sub-optimization

BiTS 2007 Tutorial

© 2007 Dynamic Test Solutions, Inc.

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2007

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PRINTED CIRCUIT BOARD INDUSTRY

World Wide Market  $50 Billion United States  $5 Billion Asia  $38 Billion Europe  $3.5 Billion Automated Test Equipment (ATE)  $500 Million Wafer and Final Test = $300 Million Burn-in Test = $200 Million

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© 2007 Dynamic Test Solutions, Inc.

March 11 - 14, 2007

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2007

Turorial 1

A BRIEF HISTORY OF THE PRINTED CIRCUIT BOARD (PCB)

1903: PCB first patented as a Printed Wiring Board. 1936: Dr Paul Eisler, an Aust rian scientist working in England is credited with making the first printed circuit board to replace radio tube wiring, with something less bulky. 1943: US Army used printed circuit boards on a wide scale to make rugged radios for World War II. 1948: US released the PCB for Commercial use.

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March 11 - 14, 2007

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A BRIEF HISTORY OF THE PRINTED CIRCUIT BOARD (PCB) (cont.)

1950s - 1960s: Expanded use of single sided printed circuit boards. 1960s - 1970s: Processes were developed for adding copper to the walls of the drilled holes in the printed circuit boards, permitting top and bottom circuitry to be electrically connected. 1980s: Multilayer development to accommodate higher component densities and complexities. Today: Layer counts greater than 50 layers, device footprints less than .4mm, Environmental sensitivity.

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© 2007 Dynamic Test Solutions, Inc.

March 11 - 14, 2007

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2007

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THE PCB MANUFACTURING PROCESS Materials Release /Shear  Insulators / Dielectric Material  Base Laminate  Fully cured, glass reinforced resin impregnated composite material.  Pre-preg  Semi-cured (B-stage), glass reinforced resin impregnated composite material.  Critical Material Characteristics to Consider  Glass Transition (Tg): The temperature at which the resin turns from a glassy state to a plastic state. Operating above Tg results in expansion of the material, and in particular, in the Z-axis. Dielectric Constant (Dk): Is the measure of the extent of a material to which it concentrates electrostatic lines of flux. It is the ratio of the amount of stored energy when a potential is applied, relative to the permittivity of a vacuum. Loss Tangent : Also known as the dissipation factor, it is the ratio of the power loss in a dielectric material to the total power transmitted through the dielectric, the imperfection of the dielectric. BiTS 2007 Tutorial © 2007 Dynamic Test Solutions, Inc. 7

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THE PCB MANUFACTURING PROCESS

BiTS 2007 Tutorial

Typical Laminate Construction

© 2007 Dynamic Test Solutions, Inc.

March 11 - 14, 2007

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THE PCB MANUFACTURING PROCESS

Materials Release /Shear  Insulators / Dielectric Material  Commonly Used Laminates Material Type Tg Dk Loss Tangent Standard FR-4 165 C 4.30 .0250 @ 1 MHz High Temp. FR-4 180 C 4.50 .0035 @ 1 MHz Polyimide 260 C 3.40 .0035 @ 1 MHz Rogers 4003 280 C 3.55 .0027 @ 10 GHz Rogers 4350 280 C 3.66 .0037 @ 10 GHz Nelco 4000-6 175 C 4.30 .0230 @ 1 MHz Nelco 4000-13 210 C 3.60 .0080 @ 10 GHz Nelco 4000-13SI 210 C 3.20 .0070 @ 10 GHz Arlon 25 N 260 C 3.38 .0025 @ 10 GHz Speedboard C 220 C 2.60 .0038 @ 3 GHz

BiTS 2007 Tutorial

© 2007 Dynamic Test Solutions, Inc.

March 11 - 14, 2007

Cost Factor 1.0 1.2 1.5 2.0 2.0 1.0 1.2 1.5 N/A N/A

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THE PCB MANUFACTURING PROCESS

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Materials Release /Shear  Conductive Material Copper foil  Electro-deposited (ED)  Rolled and Annealed (RA) Typical Foil Thicknesses  ½ oz .0007, 18 micron  1 oz .0014, 35 micron  2 oz .0028, 71 micron  4 oz, 7 oz, 10 oz for high current applications

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March 11 - 14, 2007

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