Chinese: _____________________________________________________________________________ Inspection date.________ / ________ /________ Inspection location._________________________________________________________________________ (attached map) ATTENDEESBuyer side / Supplier sideName CompanyPosition AGENDA Departure from officeArrival at the factoryDeparture from the factorySubject (dd/mm/yy, hh:mm)(dd/mm/yy, hh:mm)(dd/mm/yy, hh:mm)(As per index of this audit)INSPECTOR REMARKSSUMMARY1. PRODUCTION TECHNOLOGY□poor□avg.□+ avg.2. MATERIALS□poor□avg.□+ avg.3. QUALITY SYSTEM□poor□avg.□+ avg.4. PACKAGING□poor□avg.□+ avg.5. FINANCIALS□poor□avg.□+ avg.6. MARKET-SIDE COMPETITIVENESS□poor□avg.□+ avg.7. SUPPLY-SIDE COMPETITIVENESS□poor□avg.□+ avg.8. ORGANIZATION□poor□avg.□+ avg.INSPECTOR GENERAL OPINION□poor□avg.□+ avg.SUPPLIER COOPERATION DURING THE INSPECTION□poor□avg.□+ avg.
1.1 SORTING(Note: This stage reduces mismatch power losses)1.1.1 Arethe cells sorted by the supplier and delivered in separate batches OR are they sorted in-house? 1.1.2 (Ifsorted by the supplier) Are the cells inspected to verify they are have been properly sorted by the supplier?□poor(If sorted in house) Apparatus: See ATTACHMENT A 1.1.3 Sortingparameters: ____________________________________________________________________□poor1.2 SOLDERING/TABBING 1.2.1 Technology-1.2.2 Numberof tabs per cell: _________________________________________________________________□poor1.2.3 Taboverlap distance vs. length of cell side: ____________________________________________________□poor1.2.4 Solderingtechnology (iron heating, illumination etc.): ______________________________________________□poor1.2.5 Solderingparameters: __________________________________________________________________□poor1.2.6 (Ifmanual soldering) Do operators exhibit the necessary care in order to avoid direct touch of the cell?□poor(If automated process) Apparatus: See ATTACHMENT B 1.2.7 Breakrate: _________________________________________________________________________□poor1.2.8 Doesthe supplier properly monitors the break rate and is enacting improvement programs to reduce such occurrence?□poor1.2.9 Usebypass diode?□no1.2.10 Isthe number of cells under one bypass diode group appropriate for each specific module configuration?□poor1.3 LAMINATION 1.3.1 Arelamination and curing performed by a single machine or two separate machines? 1.3.2 Standardtemperature for lamination: ________________________________________________________ 1.3.3 Standardcycle time of lamination: __________________________________________________________ 1.3.4 Isthere evidence that each operating temp. & cycle time take into account the specific equipment / material / module?□poor1.3.5 Arethe temperature and cycle time controlled manually or automated?-1.3.6 Isthere evidence that the temperature and cycle time are regularly and properly controlled?□poor1.3.7 Apparatus:see ATTACHMENT C□poor1.4 CURING1.4.1 Standardtemperature for curing: ___________________________________________________________ 1.4.2 Standardcycle time of curing: _____________________________________________________________ 1.4.3 Isthere evidence that each operating temp. & cycle time take into account the specific equipment / material / module?□poor1.4.4 Arethe temperature and cycle time controlled manually or automated?-1.4.5 Isthere evidence that the temperature and cycle time are regularly and properly controlled?□poor1.4.6 Apparatus:see ATTACHMENT D□poorE N DO FD E M O N S T R A T I V EE X T R A C T